San Jose, CA — At 2008 IIC-China Shenzhen(Mar.3-4) & Shanghai(Mar. 10-11), Winbond Electronics Corp. introduces a new multi-message ChipCorder® with up to eight direct triggers for the automotive, industrial and consumer markets. The ISD1900 provide high quality voice in a single chip, reducing the BOM cost and shortening time to market. It is the perfect solution for applications with multiple record and playback buttons, with each button triggering a different message.

Current voice solutions providing multiple messages of similar durations often require a microcontroller with significant coding efforts. The ISD1900 eliminates both the need for a microcontroller and code programming. Therefore, engineers can quickly and easily add voice functionality into their applications and have their product ready to launch within a short period of time and at a lower BOM cost.

The ISD1900 is the latest addition to Winbond’s award winning ChipCorder® record and playback family. Key features of this series include:

· Wider operating voltage (2.4V to 5.5V)

· Higher sampling frequency (4kHz to 12kHz)

· User-selectable durations from 10.6 seconds to over 2 minutes

· Feed-through control that takes analog signals and feeds it to the speaker outputs for voice broadcasting and monitoring

· Dual operating modes:

o Multiple messages with variable duration triggered by start and end address inputs

o Up to eight messages of similar duration triggered by each individual button

The ISD1900 was also specifically designed for easy migration from older ChipCorder® series such as ISD1400 and ISD2500 which have now been End of Life. Customers can preserve the functionalities of their current designs with minor board changes needed. Details of this migration are available on the website at http://www.winbond.com/ .

“Winbond continues its commitment to provide new Voice on System Chip (VoSC) solutions to enhance its ChipCorder® family and provide engineers greater feature and design flexibility at reduced costs and time to market“, said CS Lin, Senior Director of Product Marketing, Winbond Electronics Corporation America. “We are proud to introduce our new ISD1900 because as market pressures continue to increase to provide cost effective products with shorter development time, the ISD1900 will be the solution of choice. ”

The ISD1900 is available in a 28-pin SOIC lead-free package. Die form is available under the ISD14B00 series. Additional product information for both the ISD1900 and ISD14B00 are available at http://www.winbond.com/. Samples are available now from local Winbond sales offices and its authorized representatives.

About Winbond

Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan. The company owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the development of four main product lines, including μC & μC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.

Winbond has five business groups, including Consumer IC Business Group, Computer Logic IC Business Group, DRAM Product Business Group, Flash Memory IC Business Group, and Memory IC Manufacturing Business Group. Each business group operates as a profit center to strengthen the company’s operation model and keep the maneuverability and flexibility of the organization to adapt to the ever-changing semiconductor industry.

Winbond has over 4,000 employees worldwide and operates one 150mm wafer fab and one 300mm wafer fab. Winbond owns more than 2,500 patents worldwide and has subsidiaries in the USA, China, Israel, and Japan.

For more information, please visit: http://www.winbond.com